| 发明名称 |
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A semiconductor package includes a package member and a stress controlling layer. The package member includes an encapsulation layer and at least one chip. The encapsulation layer encapsulates the at least one chip. The stress controlling layer is disposed on a surface of the package member. The stress controlling layer has an internal stress to the extent that the stress controlling layer prevents the package member from having warpage. |
| 申请公布号 |
US2017047294(A1) |
申请公布日期 |
2017.02.16 |
| 申请号 |
US201615174411 |
申请日期 |
2016.06.06 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHANG GUN-HO;Cho Tae-je;Shim Jong-bo |
| 分类号 |
H01L23/00;H01L25/00;H01L25/065 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package comprising:
a package member including an encapsulation layer and at least one chip, wherein the encapsulation layer encapsulates the at least one chip; and a stress controlling layer disposed on a first surface of the package member, wherein the stress controlling layer has an internal stress to the extent that the stress controlling layer prevents the package member from having warpage. |
| 地址 |
SUWON-SI KR |
