MULTILAYER ELECTRONIC MODULE, IN PARTICULAR FOR A CONTACTLESS CHIP CARD

摘要

The invention relates to an electronic module for a portable object communicating by means of radiofrequency, in particular for a contactless chip card. Said electronic module comprises: a first substrate (S1) to which a microelectronic chip () is attached, and a first antenna connected to said chip and formed by a plurality of coils surrounding said microelectronic chip, characterized in that it comprises a second substrate (S2) provided with a second antenna, said second substrate being placed on top of the first substrate.