| 摘要 |
H:/par/lntcrm-venUWRorbl/DCC/PAR/6454664_Ldoc-2506120 L4 A heat pipe can include a microchannel heat exchanger at the heat absorbing end and another heat exchanger which is optionally also a microchannel heat exchanger at the heat sink end, with one or more pipes flowably connecting the two ends for transporting liquid working fluid to the head absorber and vaporized working fluid to the heat sink. The heat pipes may be used to cool electronic devices with rejection of heat outside an enclosure, and optionally outside a room, containing the electronic devices. The heat pipes may be used to cool photovoltaic or solar collection devices with rejection of heat to ambient air at a distance removed from the photovoltaic devices. Heat pipe systems are disclosed wherein the working fluid is a hydrofluorocarbon or a mono-chlorinated hydrofluoroalkene having a normal boiling point in a range from I 0C to 80'C. WO 20091085307 PCTUS200SIO14O81 L cc Ic to |
