发明名称 Semiconductor Photomultiplier
摘要 The present disclosure relates to a semiconductor photomultiplier comprising a a substrate; an array of photosensitive elements formed on a first major surface of the substrate; a plurality of primary bus lines interconnecting the photosensitive elements; at least one segmented secondary bus line provided on a second major surface of the substrate which is operably coupled to one or more terminals; and multiple vertical interconnect access (via) extending through the substrate operably coupling the primary bus lines to the at least one segmented secondary bus line.
申请公布号 US2017047372(A1) 申请公布日期 2017.02.16
申请号 US201615335658 申请日期 2016.10.27
申请人 SensL Technologies LTD 发明人 McGarvey Brian;Bellis Stephen John;Jackson John Carlton
分类号 H01L27/146;H01L31/107;H01L49/02 主分类号 H01L27/146
代理机构 代理人
主权项 1. A semiconductor photomultiplier comprising: a substrate; an array of photosensitive elements formed on a first major surface of the substrate; a plurality of first bus lines formed on the first major surface each interconnecting a corresponding group of the photosensitive elements together; a segmented second bus line being provided on the first major surface of the substrate defining multiple segments; the first bus lines being interconnected by the segmented second bus line on the first major surface; the segments of the second bus line are shorted together using multiple vertical interconnect access (vias) which extend through the substrate and operably couple the multiple segments of the second bus line together via a network of routing tracks formed on the second major surface of the substrate such that multiple segments are shorted together on the second major surface of the substrate for minimising transit times of output signals from the respective groups of photosensitive elements.
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