Double Side Heat Dissipation for Silicon Chip Package

摘要

System, method, and silicon chip package for providing structural strength, heat dissipation and electrical connectivity using “W” shaped frame bonded to the one or more dies, wherein the “W” shaped frame provides compression strength to the silicon chip package when the one or more dies are bonded, and electrically conductivity between for the one or more dies to leads of silicon chip package, and heat dissipation for the silicon chip package.

主权项

1. A method for forming a dual sided chip package comprising:
superimposing a frame to one or more dies; bonding the frame to the one or more dies; molding the frame to one or more dies with an upside mold die and a downside mold die; and singulating the frame, wherein a surface mount area of the frame is larger than surface mount area of the one or more die, and the singulating exposes heatsink surfaces of the frame.