发明名称 AQUEOUS PRIMER COMPOSITION FOR ENHANCED FILM FORMATION AND METHOD OF USING THE SAME
摘要 A water-based bonding primer composition and a method of applying the same onto a metallic surface prior to adhesive bonding. The bonding primer composition is a water-based dispersion containing water, one or more epoxy resins, one or more curing agents, a silane compound, a low amount of propylene carbonate (PC), and optional additives. The bonding primer composition can form substantially smooth films by spraying, and at the same time, meet environmental regulations and provide high bonding performance.
申请公布号 US2017044381(A1) 申请公布日期 2017.02.16
申请号 US201615340475 申请日期 2016.11.01
申请人 CYTEC INDUSTRIES INC. 发明人 ZHAO Yiqiang;KOHLI Dalip K.;SHAH Gaurang Kunal
分类号 C09D5/12;C09D7/12;C09D163/00 主分类号 C09D5/12
代理机构 代理人
主权项
地址 Woodland Park NJ US
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