| 摘要 |
Provided are a sputtering apparatus with which it is possible to reduce apparatus production cost, and a film formation method. In one embodiment, a sputtering apparatus 100 is provided with: a vacuum container 10; a pillar-shaped target holder (20) for holding first and second targets T1, T2 in parallel along the circumferential direction; a treatment object holder 32 that is for holding an object S to be treated inside the vacuum container and that is disposed facing the target holder; a first rotating part 31 for rotating the treatment object holder around the central axis C of the target holder; first and second power supply units 41, 42 for supplying plasma-generating power and bias-applying power to the target holder and the treatment object holder; and a shutter mechanism 50 comprising a shutter part 52 with masking regions A1 and non-masking regions A2 that are alternately disposed around the central axis of the target holder between the rotation track of the treatment object holder and the target holder, and a second rotating part 51 for rotating the shutter part around the central axis of the target holder. |
