| 摘要 |
The present invention provides a laser system capable of externally releasing heat generated by a laser device using a simple and inexpensive configuration. The laser system 101 is provided with a semiconductor laser module 120 for emitting a laser beam, a heat transfer member 80 on which the semiconductor laser module 120 is placed, and heat absorption members 70A, 70B. The heat transfer member 80 has a heat transfer surface 80A through which heat generated by a laser element 54 of the semiconductor laser module 120 is transmitted. The heat absorption members 70A, 70B can be disposed in a heat absorption space E, which is formed adjacent to the heat transfer surface 80A of the heat transfer member 80, in contact with the heat transfer surface 80A. The heat absorption members 70A, 70B can be moved from the heat absorption space E to a heat release space R for releasing the heat absorbed in the heat absorption space E. The laser system 101 is provided with a movement mechanism 74 for moving the heat absorption members 70A, 70B from the heat absorption space E to the heat release space R. |
