| 发明名称 |
PACKAGING ARRANGEMENTS INCLUDING A SERIALIZING DRAM INTERFACE DIE |
| 摘要 |
Embodiments provide a packaging arrangement that comprises a package substrate. A random access memory die is coupled to the package substrate and a serializing random access memory interface die coupled to (i) the package substrate and (ii) the random access memory die. |
| 申请公布号 |
WO2017027445(A1) |
申请公布日期 |
2017.02.16 |
| 申请号 |
WO2016US45975 |
申请日期 |
2016.08.08 |
| 申请人 |
MARVELL WORLD TRADE LTD. |
发明人 |
LIU, Chenglin;LIOU, Shiann-Ming |
| 分类号 |
H01L25/065;G06F13/38 |
主分类号 |
H01L25/065 |
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