发明名称 PHOTONIC SINTERING OF A SOLDERABLE POLYMER THICK FILM COPPER CONDUCTOR COMPOSITION
摘要 This invention provides a polymer thick film copper conductor composition for forming a solderable and highly solder leach resistant electrical conductor and a method for using the polymer thick film copper conductor composition to form the electrical conductor in an electrical circuit. The method subjects the deposited thick film copper conductor composition to photonic sintering. The invention further provides electrical devices containing electrical conductors made from the polymer thick film copper conductor composition and also those formed by the method.
申请公布号 WO2017027496(A2) 申请公布日期 2017.02.16
申请号 WO2016US46121 申请日期 2016.08.09
申请人 E. I. DU PONT DE NEMOURS AND COMPANY 发明人 SUH, Seigi
分类号 H01B1/22 主分类号 H01B1/22
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