发明名称 SINTERED MECHANICAL COMPONENT, DEVICE FOR FORMING POWDER COMPACT, AND METHOD FOR FORMING POWDER COMPACT
摘要 Provided is a sintered gear (1) as a sintered machine part, which is formed of a sintered compact (M′) and which rotates in conjunction with an input of a load from another member onto a radially outer surface while sliding with respect to a shaft (S) inserted along an inner periphery, in which the sintered compact (M′) includes an inner layer (2) containing Cu and an outer layer (3) sintered together with the inner layer (2) under a state of being held in contact with the inner layer (2), in which the outer layer (3) includes, as main components, Fe, Cu, and Sn as a low-melting-point metal, and a metal structure of the outer layer (3) includes, as main constituents, Fe structures and Cu—Sn alloy structures, which exist at a grain boundary of the Fe structures and bind the Fe structures to each other.
申请公布号 US2017045136(A1) 申请公布日期 2017.02.16
申请号 US201515305243 申请日期 2015.04.17
申请人 NTN CORPORATION 发明人 TAGA Seiji;NAKAYAMA Toshio;MATSUDUKI Takehiro;SUGAI Yousuke;MOURI Toshihiko
分类号 F16H57/08;B22F5/08;C22C38/16;F16C33/12;F16H55/17;B30B15/02;B30B15/30;B22F3/03;C22C38/00 主分类号 F16H57/08
代理机构 代理人
主权项 1. A sintered machine part, which is formed of a sintered compact and which rotates in conjunction with an input of a load from another member onto a radially outer surface while sliding with respect to a shaft inserted along an inner periphery, wherein the sintered compact comprises an inner layer containing Cu and an outer layer sintered together with the inner layer under a state of being held in contact with the inner layer, wherein the outer layer comprises, as main components, Fe, Cu, and a low-melting-point metal having a melting point lower than a melting point of Cu, and a metal structure of the outer layer comprises, as main constituents, Fe structures and alloy structures of Cu and the low-melting-point metal, which exist at a grain boundary of the Fe structures and bind the Fe structures to each other.
地址 Osaka JP