| 摘要 |
The invention is directed to a paste composition and a process for forming a solderable polyimide-based polymer thick film conductor. The paste composition comprising an electrically conductive metal, a polyimide, an organosilicon compound and an organic solvent and can be cured by heating at a temperature of 320 to 380°C. The invention also provides an electrical device containing a solderable polyimide-based polymer thick film conductor formed using the paste composition. |
