LIQUID CRYSTAL DISPLAY PANEL AND METHOD OF FABRICATING THE SAME

摘要

Provided is a method of fabricating a liquid crystal display panel. An active device array substrate and an opposite substrate are provided, wherein the active device array substrate includes a first substrate and a first electrode layer, and the opposite substrate includes a second substrate and a second electrode layer. A first alignment film is formed on the first electrode layer and a second alignment film is formed on the second electrode layer. A sealant composition including an adhesive and conductive particles is applied on one of the first alignment film and the second alignment film. The active device array substrate and the opposite substrate are assembled, wherein the assembling step includes heating the sealant composition so as to merge a part of the conductive particles into a conductive material piercing through the first alignment film and the second alignment film, respectively.

主权项

1. A method of fabricating a liquid crystal display panel, comprising:
providing an active device array substrate and an opposite substrate, wherein the active device array substrate comprises a first substrate and a first electrode layer disposed on the first substrate, and the opposite substrate comprises a second substrate and a second electrode layer disposed on the second substrate; forming a first alignment film on the first electrode layer and a second alignment film on the second electrode layer; applying a sealant composition on one of the first alignment film and the second alignment film, wherein the sealant composition comprises an adhesive and a plurality of conductive particles dispersed in the adhesive; and assembling the active device array substrate and the opposite substrate, wherein assembling the active device array substrate and the opposite substrate comprises:
curing the adhesive by subjecting the sealant composition to a heat; andrespectively merging a part of the conductive particles into a plurality of bulk conductive materials by the heat, wherein at least one of the bulk conductive materials pierces through the first alignment film and the second alignment film, and an other part of the conductive particles electrically connected to the bulk conductive materials.