| 发明名称 |
MOLDING APPARATUS AND MOLDING METHOD |
| 摘要 |
To provide a molding apparatus that has satisfactory thermal energy efficiency and can be reduced in size and a molding method.;A molding apparatus 1 includes a tape conveying mechanism 6 that conveys a molding material 10 having flexibility to a molding position on a stage 2, a laser radiating mechanism 7 that radiates a laser beam on the molding material 10 conveyed to the molding position, and a moving mechanism 4 that moves the molding position P relatively to the stage. |
| 申请公布号 |
US2017043433(A1) |
申请公布日期 |
2017.02.16 |
| 申请号 |
US201515303198 |
申请日期 |
2015.04.10 |
| 申请人 |
SEIKO EPSON CORPORATION |
发明人 |
KOGA Yoshiro;MIYASHITA Takeshi;KAMAKURA Tomoyuki |
| 分类号 |
B23K26/342;B23K26/08;B33Y50/02;B33Y30/00;B33Y40/00;B29C67/00;B23K26/70;B33Y10/00 |
主分类号 |
B23K26/342 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A molding apparatus comprising:
a feeding mechanism that conveys a molding material having flexibility to a molding position on a stage; a laser radiating mechanism that radiates a laser beam on the molding material conveyed to the molding position and melts the molding material; and a moving mechanism that moves the molding position relatively to the stage. |
| 地址 |
Tokyo JP |
