METHOD FOR CUTTING BRITTLE SUBSTRATE

摘要

A blade edge is moved on a first surface (SF1) of a brittle substrate (11) while the blade edge is pressed against the first surface (SF1), and a trench line (TL) having a first portion (LR) and a second portion (HR) is thereby formed so as to be in a crackless state. The load applied to the blade edge in order to form the second portion (HR) is greater than the load applied to the blade edge in order to form the first portion (LR). A crack is caused to occur along the second portion (HR). A stress applying member (85) is brought into contact with a fourth portion (SP4) facing the second portion (HR) of the trench line (TL) in the second surface (SF2), while being separated from a third portion (SP3) facing the first portion (LR) of the trench line (TL) in the second surface (SF2). The stress applying member (85) is subsequently brought into contact with the third portion (SP3).