发明名称 |
PACKAGING METHOD FOR ELECTRONIC DEVICE AND PACKAGING SYSTEM |
摘要 |
The present invention provides a packaging method for an electronic device, which includes a step of forming a packaging substrate, the step of the forming a packaging substrate includes: forming, on a base substrate, a defining pattern which comprises a groove for defining position of frit; providing colloidal frit in the groove; presintering the colloidal frit to obtain preliminarily cured frit; polishing upper surfaces of the defining pattern and the preliminarily cured frit; and removing the defining pattern, and completely curing the preliminarily cured frit, so as to form solid frit on the base substrate. The present invention also provides a packaging system. By using the packaging method provided by the present invention, a better packaging effect can be achieved. |
申请公布号 |
US2017047538(A1) |
申请公布日期 |
2017.02.16 |
申请号 |
US201514913090 |
申请日期 |
2015.07.16 |
申请人 |
BOE TECHNOLOGY GROUP CO., LTD. ;ORDOS YUANSHENG OPTOELECTRONICS CO., LTD. |
发明人 |
JIANG Zhiliang;XUAN Minghua;JI Fengli;ZHANG Bo;CHEN Fei;GAI Renrong |
分类号 |
H01L51/52;H01L51/56;H01L23/00 |
主分类号 |
H01L51/52 |
代理机构 |
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代理人 |
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主权项 |
1. A packaging method for an electronic device, comprising a step of: forming a packaging substrate, wherein the step of forming a packaging substrate comprises sub-steps:
forming a defining pattern on a base substrate, wherein the defining pattern comprises a groove for defining position of frit; providing colloidal frit in the groove; presintering the colloidal frit to obtain preliminarily cured frit; polishing upper surfaces of the defining pattern and the preliminarily cured frit; and removing the defining pattern to form solid frit on the base substrate, so that the packaging substrate is obtained. |
地址 |
Beijing CN |