发明名称 |
STRAINED GATE-ALL-AROUND SEMICONDUCTOR DEVICES FORMED ON GLOBALLY OR LOCALLY ISOLATED SUBSTRATES |
摘要 |
Strained gate-all-around semiconductor devices formed on globally or locally isolated substrates are described. For example, a semiconductor device includes a semiconductor substrate. An insulating structure is disposed above the semiconductor substrate. A three-dimensional channel region is disposed above the insulating structure. Source and drain regions are disposed on either side of the three-dimensional channel region and on an epitaxial seed layer. The epitaxial seed layer is composed of a semiconductor material different from the three-dimensional channel region and disposed on the insulating structure. A gate electrode stack surrounds the three-dimensional channel region with a portion disposed on the insulating structure and laterally adjacent to the epitaxial seed layer. |
申请公布号 |
US2017047416(A1) |
申请公布日期 |
2017.02.16 |
申请号 |
US201615335281 |
申请日期 |
2016.10.26 |
申请人 |
Cappellani Annalisa;Pethe Abhijit Jayant;Ghani Tahir;Gomez Harry |
发明人 |
Cappellani Annalisa;Pethe Abhijit Jayant;Ghani Tahir;Gomez Harry |
分类号 |
H01L29/423;H01L29/786;H01L29/06;H01L29/78 |
主分类号 |
H01L29/423 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device, comprising:
a semiconductor substrate; an isolation pedestal disposed above the semiconductor substrate, the isolation pedestal having a unitary body with a non-planar uppermost surface; a three-dimensional channel region disposed above the isolation pedestal; source and drain regions disposed on either side of the three-dimensional channel region; and a gate electrode stack surrounding the three-dimensional channel region with a portion disposed on the non-planar uppermost surface of the isolation pedestal. |
地址 |
Portland OR US |