发明名称 STRAINED GATE-ALL-AROUND SEMICONDUCTOR DEVICES FORMED ON GLOBALLY OR LOCALLY ISOLATED SUBSTRATES
摘要 Strained gate-all-around semiconductor devices formed on globally or locally isolated substrates are described. For example, a semiconductor device includes a semiconductor substrate. An insulating structure is disposed above the semiconductor substrate. A three-dimensional channel region is disposed above the insulating structure. Source and drain regions are disposed on either side of the three-dimensional channel region and on an epitaxial seed layer. The epitaxial seed layer is composed of a semiconductor material different from the three-dimensional channel region and disposed on the insulating structure. A gate electrode stack surrounds the three-dimensional channel region with a portion disposed on the insulating structure and laterally adjacent to the epitaxial seed layer.
申请公布号 US2017047416(A1) 申请公布日期 2017.02.16
申请号 US201615335281 申请日期 2016.10.26
申请人 Cappellani Annalisa;Pethe Abhijit Jayant;Ghani Tahir;Gomez Harry 发明人 Cappellani Annalisa;Pethe Abhijit Jayant;Ghani Tahir;Gomez Harry
分类号 H01L29/423;H01L29/786;H01L29/06;H01L29/78 主分类号 H01L29/423
代理机构 代理人
主权项 1. A semiconductor device, comprising: a semiconductor substrate; an isolation pedestal disposed above the semiconductor substrate, the isolation pedestal having a unitary body with a non-planar uppermost surface; a three-dimensional channel region disposed above the isolation pedestal; source and drain regions disposed on either side of the three-dimensional channel region; and a gate electrode stack surrounding the three-dimensional channel region with a portion disposed on the non-planar uppermost surface of the isolation pedestal.
地址 Portland OR US