发明名称 IMAGING DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 In an imaging device having a waveguide, a surface of an insulating film covering a seal ring is prevented from getting rough. A pixel region, a peripheral circuit region, and a seal region are defined over a semiconductor substrate. After formation of a pad electrode in the peripheral circuit region and a seal ring in the seal ring region, a TEOS film is so formed as to cover the pad electrode and the seal ring. A pattern of a photoresist for exposing a portion of the TEOS film covering the pad electrode and the seal ring, respectively, is formed and etching treatment is subjected to the exposed TEOS film. Then, after the pattern of the photoresist has been formed, a second waveguide holding hole is formed in the pixel region by performing etching treatment.
申请公布号 US2017047368(A1) 申请公布日期 2017.02.16
申请号 US201615333308 申请日期 2016.10.25
申请人 Renesas Electronics Corporation 发明人 TOMITA Kazuo
分类号 H01L27/146;H01L23/58 主分类号 H01L27/146
代理机构 代理人
主权项 1. A solid-state image sensing device, comprising: a semiconductor substrate having a main surface, a pixel region including a plurality of pixels formed on the main surface of the semiconductor substrate, a peripheral circuit region formed outside of the pixel region, a seal ring region including a seal ring formed outside of the peripheral circuit region and continuously enclosing the pixel region and the peripheral region, a protective insulating film formed to cover the pixel region, the peripheral circuit region, and the seal ring region, and a groove formed over the seal ring without penetrating through the protective insulating film, wherein in a plan view, a width of the groove is larger than a width of the top part of the seal ring, and in a direction perpendicular to an extending direction of the seal ring, the center of the groove is displaced outside of the center of the seal ring.
地址 Kawasaki-shi JP