发明名称 READ DISTRIBUTION IN A THREE-DIMENSIONAL STACKED MEMORY BASED ON THERMAL PROFILES
摘要 A memory controller may receive a plurality of thermal profiles from a plurality of three-dimensional (3D)-stacked memory chips, where the plurality of thermal profiles include thermal profile data for the memory chips, where the thermal profile data includes a memory chip usage data and a location data for each of the memory chips, and where the memory chips include a first memory chip and a second memory chip. The memory controller may generate a first predicted memory chip usage data and location data by analyzing the usage data and location data of the thermal profile data. A second predicted memory chip usage data and location data may be generated. Based on the predicted memory chip, fractional memory chip read propensity data may be generated. The memory controller may distribute, according the first fractional memory chip read propensity distribution, memory chip read operations.
申请公布号 US2017046079(A1) 申请公布日期 2017.02.16
申请号 US201514823383 申请日期 2015.08.11
申请人 International Business Machines Corporation 发明人 Chinnakkonda Vidyapoornachary Diyanesh B.;Sethuraman Saravanan;Wright Kenneth L.
分类号 G06F3/06 主分类号 G06F3/06
代理机构 代理人
主权项 1. A method, comprising: receiving, by a memory controller, a plurality of thermal profiles from a plurality of three-dimensional (3D)-stacked memory chips, wherein the plurality of thermal profiles include thermal profile data for the memory chips, wherein the thermal profile data includes a memory chip usage data and a location data for each of the memory chips, and wherein the memory chips include a first memory chip and a second memory chip; generating, by the memory controller, a first predicted memory chip usage data and location data of the first memory chip by analyzing the usage data and location data of the thermal profile data of the first memory chip; generating, by the memory controller, a second predicted memory chip usage data and location data of the second memory chip by analyzing the usage data and location data of the thermal profile data of the second memory chip; determining, by the memory controller, based on the first predicted memory chip usage and the second predicted memory chip usage, fractional memory chip read propensity data for the first memory chip and the second memory chip, wherein the fractional memory chip read propensity data includes memory chip read distribution data; determining, by the memory controller, a first fractional memory chip read propensity distribution, based on the fractional memory chip read propensity data; and distributing, by the memory controller, according the first fractional memory chip read propensity distribution, memory chip read operations to the first memory chip and the second memory chip.
地址 Armonk NY US