TAPE CHIP ON LEAD USING PASTE DIE ATTACH MATERIAL

摘要

According to various embodiments, systems and methods for packaging a semiconductor device are provided. The disclosure discusses a semiconductor die having a top side and a bottom side that is disposed on a lead frame. An adhesive paste is then applied to attach the semiconductor die to the lead frame such that the adhesive paste fixes the die to a portion of the lead frame. The adhesive paste may be applied directly between die and the lead frame or may be applied in conjunction with a frame tape.

主权项

1. A semiconductor package, comprising:
a semiconductor die having a top side and a bottom side; a lead frame disposed beneath the semiconductor die; a tape layer comprising a plurality of discontinuous tape strips disposed between the semiconductor die and the lead frame; a non-conductive paste layer disposed on a portion of the bottom side of the semiconductor die such that the paste layer fixes the semiconductor die to a portion of the lead frame, wherein the paste layer is disposed such that it covers a portion of the tape layer without overflowing the tape layer, and wherein the paste layer requires curing to fix the semiconductor die to the portion of the lead frame; and an encapsulation enclosing the semiconductor die, the lead frame, and the paste layer.