ENCAPSULATION FILM

摘要

Provided are an encapsulation film, an organic electronic device including the same, and a method of manufacturing the organic electronic device. Therefore, provided is the encapsulation film, which may form a structure capable of effectively blocking moisture or water entering the organic electronic device from the outside, and have excellent processability in a process of manufacturing a panel and excellent heat retention under a high-temperature and high-humidity condition.

主权项

1. An encapsulation film, comprising:
a polymer derived from butylene; and a pressure-sensitive adhesive layer satisfying General Equation 1,
d≦1 mm   [General Equation 1] where d is a creeping distance of the pressure-sensitive adhesive layer creeped when a sample prepared by forming the pressure-sensitive adhesive layer having a thickness of 50 μm on one surface of a metal base is attached to a glass in an adhesive area of 1 cm×1 cm, and 500 g of a weight is loaded to the metal base at 85° C. for 1 hour in a gravity direction.