CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

The present application provides a chip electronic component and a manufacturing method thereof. More particularly, there is provided a chip electronic component including a thin insulating film having a reduced width and extended up to a lower portion of a coil pattern without exposing the coil pattern such that the coil pattern has no direct contact with a magnetic material, thereby preventing a poor waveform at high frequency and increasing inductance.

主权项

1. A chip electronic component, comprising:
a magnetic body including an insulating substrate; a coil pattern part disposed on at least one surface of the insulating substrate; a thin polymer insulating film coating the coil pattern part; and external electrodes disposed on at least one end surface of the magnetic body and connected to the coil pattern part, wherein a shape of a surface of the thin polymer insulating film substantially conforms to a shape of a surface of the coil pattern part, and the thin polymer insulating film has a thickness of 1 μm to 3 μm.