CURABLE COMPOSITION AND CURED PRODUCT FROM SAME

摘要

Provided is a curable composition that has excellent curability and that can prevent a silicone mold from swelling and thereby improve the durability of the silicone mold and increase the number of times that the silicone mold can be used. This curable composition contains curable compounds and a cationic polymerization initiator and is for molding optical components by means of a silicone mold. As curable compounds, the curable composition contains an alicyclic epoxy compound (A) and an oxetane compound (B). The oxetane compound (B) is 10-45 weight% of the total amount of curable compounds included in the curable composition, and 90 weight% or less of the total amount of curable compounds included in the curable composition is a compound that has a Fedors SP value of 9.0 (cal/cm3)1/2 or higher at 25°C.