| 摘要 |
An array substrate and a manufacturing method therefor. The method comprises: forming a buffer layer (22), a light-shielding layer (23) and a whole semiconductor layer (24) on a base substrate (21), and simultaneously patterning the semiconductor layer (24) and the light-shielding layer (23); and then successively forming a first insulating layer (25), first metal layers (26, 261), a second insulating layer (27), a second metal layer (28), a flat layer (29) and a first transparent conductive layer (30) on the patterned semiconductor layer (24). |
