Elektrische Kontaktstruktur für ein Halbleiterbauelement und Halbleiterbauelement

摘要

The invention relates to an electric contact structure (10) for a semiconductor component (100), having a transparent electrically conductive contact layer (1), to which a first metallic contact layer (2) is applied, a second metallic contact layer (3), which covers the first metallic contact layer (2) completely, and a separating layer (4), which is arranged between the transparent electrically conductive contact layer (1) and the second metallic contact layer (3) and separates the second metallic contact layer (3) from the transparent electrically conductive contact layer (1). The invention further relates to a semiconductor component (100) having such an electric contact structure (10).