| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing damages caused by stress generated by a difference in linear expansion coefficient between a lead frame and a semiconductor chip.SOLUTION: A semiconductor device comprises: a semiconductor chip; a lead frame having a central region where the semiconductor chip is arranged, and a peripheral region adjacent to a periphery of the central region; a die-attach material bonding the lead frame and the semiconductor chip with each other; and an encapsulation resin arranged on the lead frame to cover the semiconductor chip. In the peripheral region of the lead frame, a plurality of slits radially extending and swirling from a boundary between the central region and the peripheral region toward an outer edge of the peripheral region are formed so that widths of the slits are wider as they go away further from the central region. |
