| 摘要 |
PROBLEM TO BE SOLVED: To obtain a liquid crystalline resin composition having higher thermal conductivity.SOLUTION: A highly thermally conductive resin composition includes a mesogen containing epoxy resin (A), a specific aromatic amine-based curing agent (B), and a thermally conductive filler (C). With respect to 100 pts.wt. of the total of the component (A) and component (B), 5 pts.wt. or more and 150 pts.wt. or less of the component (C) is included. |
