| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermally conductive paste which offers a silver film increased in mechanical strength and reliability.SOLUTION: The thermally conductive paste comprises silver fine particles and a thermosetting binder. The silver fine particles consist of: low-temperature sinterable silver fine particles; silver fine particles having an average particle diameter of 1-500 nm, and meeting the conditions of &Dgr;WCC≥1%, and &Dgr;WCC-&Dgr;WCC≤0.7%, where &Dgr;WCC and &Dgr;WCC denote a decrease in weight from 25°C to 200°C, and a decrease in weight from 25°C to 500°C in a thermogravimetric analysis with a rate of temperature rise of 10°C/minute from a temperature of 25°C or below, respectively; or silver fine particles having an average particle diameter of 40-350 nm, and a crystallite diameter of 20-70 nm, provided that the ratio of the average particle diameter to the crystallite diameter is 1-5. In the thermally conductive paste, the content of the thermosetting binder is 2-7 pts.mass to 100 pts.mass of such silver fine particles. In the semiconductor device, the thermally conductive paste is used for connecting a part. |
