发明名称 全熱交換素子用仕切板の素材の製造方法
摘要 PROBLEM TO BE SOLVED: To provide a heat exchange type ventilation device having high total enthalpy heat exchange efficiency and preventing the deterioration of performance caused by dew formation, in the heat exchange type ventilation device for domestic use and commercial use.SOLUTION: By using a material for a total enthalpy heat exchange element that is obtained by polymerizing at least one type of a low-molecular organic compound becoming a hydrophilic high-molecular compound by polymerization in a porous base material, a total enthalpy heat exchange element which has high latent heat exchange efficiency is hardly soluble in water and has high barrier performance is obtained. Thus, a heat exchange type ventilation device that has high total enthalpy heat exchange efficiency and prevents performance deterioration caused by dew formation can be obtained.
申请公布号 JP6078775(B2) 申请公布日期 2017.02.15
申请号 JP20120059785 申请日期 2012.03.16
申请人 パナソニックIPマネジメント株式会社 发明人 浜田 洋祐;村山 拓也;近藤 広幸;大友 みゆき
分类号 F24F7/08;C08F2/00;C08F283/00;C08K5/00;C08L101/00 主分类号 F24F7/08
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