Liquid-cooled assembly with in-line power semiconductor modules and at least one capacitor device and power semiconductor module therefor

摘要

The arrangement has a set of connection devices (110, 120, 130, 140) arranged in pairs on main sides (2a, 2b) of two power semiconductor modules (1) for connecting the main sides of the power semiconductor modules with one another. A capacitor is arranged between the power semiconductor modules, where the capacitor is directly or indirectly cooled by a cooling circuit. One of the power semiconductor modules is provided with a power electronics switch (20), and a U-shaped flow-conducting cooling device (10) cools the power electronics switch. An independent claim is also included for a power semiconductor module.