| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus and a using method of the same, which can obtain uniform etching characteristics even when a processing condition and the size of a wafer change.SOLUTION: A semiconductor manufacturing apparatus comprises: a first antenna 111 having first openings; a second antenna 112 having second openings; position control means (115, 116) for relatively controlling a position of the first antenna with respect to the second antenna 112; and a control device 127 for controlling the position control means so as to make a distribution of the second openings be an intended distribution. |
