发明名称 積層膜の処理方法および半導体装置の作製方法
摘要 In a processing method of a stacked-layer film in which a metal film is provided on an oxide insulating film, plasma containing an oxygen ion is generated by applying high-frequency power with power density greater than or equal to 0.59 W/cm2 and less than or equal to 1.18 W/cm2 to the stacked-layer film side under an atmosphere containing oxygen in which pressure is greater than or equal to 5 Pa and less than or equal to 15 Pa, the metal film is oxidized by the oxygen ion, and an oxide insulating film containing excess oxygen is formed by supplying oxygen to the oxide insulating film.
申请公布号 JP6082640(B2) 申请公布日期 2017.02.15
申请号 JP20130078476 申请日期 2013.04.04
申请人 株式会社半導体エネルギー研究所 发明人 花岡 一哉;笹川 慎也
分类号 H01L21/336;G02F1/1368;H01L21/316;H01L21/8242;H01L27/108;H01L27/115;H01L29/786;H01L29/788;H01L29/792;H01L51/50;H05B33/14 主分类号 H01L21/336
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