发明名称 発光装置
摘要 Provided is a light emitting device in which stress experienced between the light emitting element and the substrate member can be reduced. The light emitting device 100 includes a substrate member 10 and at least one light emitting element 30. The substrate member 10 has a groove portion 14 defined between adjacent two wiring portions 12 spaced apart from each other. The groove portion 14 includes a first groove portion 141 extending in a third direction that forms at a slanted angle with respect to a first direction, a second groove portion 142 spaced apart from the first groove portion 141 and extending in the third direction, and a third groove portion 143 interconnected with the first groove portion 141 and the second groove portion 142. The light emitting element 30 is disposed over the third groove portion 143.
申请公布号 JP6079159(B2) 申请公布日期 2017.02.15
申请号 JP20120252211 申请日期 2012.11.16
申请人 日亜化学工業株式会社 发明人 丸谷 幸利
分类号 H01L33/62 主分类号 H01L33/62
代理机构 代理人
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