发明名称 ガラス基板積層体の加工方法
摘要 Provided is a method for satisfactorily suppressing erosion of the surface layer by the etching liquid when an outer profile processing is performed on a hard substrate laminated body such as a glass substrate by etching, and efficiently processing the hard substrate laminated body such as a glass substrate. A method for processing a hard substrate laminated body, including: a step of readying a hard substrate laminated body obtained by bonding two or more hard substrates using an adhesive, at least one of the hard substrates being provided on the substrate surface with one or more layers selected from the group consisting of a metal layer, a resin layer, a silica layer, an organosilicate layer, and a transparent electrode layer, the hard substrate laminated body being subjected to predetermined chamfering; and a step of immersing the chamfered hard substrate laminated body in the etching liquid and performing etching in a state in which the laminated body is held by a clamp jig which presses the entirety of both surfaces of the laminated body in the thickness direction.
申请公布号 JP6081363(B2) 申请公布日期 2017.02.15
申请号 JP20130533743 申请日期 2012.09.14
申请人 デンカ株式会社 发明人 江田 幸雄;武間 淳一郎;栗村 啓之;伊林 敏成
分类号 C03C15/00;C03C27/10 主分类号 C03C15/00
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