| 摘要 |
A semiconductor chip mounting layer (20) of a package substrate unit (1) includes an insulation layer (21), a conductive seed metal layer (22a) formed on the top surface of the insulation layer (21), conductive pads (23) formed on the top surface of the conductive seed metal layer (22a), metal posts (24) formed substantially in the central portion on the top surface of the conductive pads (23), and a solder resist layer (25) that is formed to surround the conductive pads (23) and the metal posts (24). |
