发明名称 BI-LEVEL BI-CLASS THERMAL MITIGATION TECHNIQUE FOR SINGLE/MULTI-SIM DEVICES
摘要 A method of providing thermal mitigation for a mobile device includes: receiving at least one temperature signal indicative of at least one operating temperature of the mobile device; comparing the at least one temperature signal to a plurality of progressively higher temperature thresholds; and selecting one of a plurality of thermal mitigation plans based on one of a plurality of mobile device operating modes and the comparison of the at least one temperature signal with the plurality of temperature thresholds
申请公布号 EP3129851(A1) 申请公布日期 2017.02.15
申请号 EP20150718049 申请日期 2015.04.03
申请人 Qualcomm Incorporated 发明人 NAYAK, Shivank;NAGPAL, Shilpa;KUMAR, Ajeet
分类号 G06F1/20;G06F1/32 主分类号 G06F1/20
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