发明名称 |
BI-LEVEL BI-CLASS THERMAL MITIGATION TECHNIQUE FOR SINGLE/MULTI-SIM DEVICES |
摘要 |
A method of providing thermal mitigation for a mobile device includes: receiving at least one temperature signal indicative of at least one operating temperature of the mobile device; comparing the at least one temperature signal to a plurality of progressively higher temperature thresholds; and selecting one of a plurality of thermal mitigation plans based on one of a plurality of mobile device operating modes and the comparison of the at least one temperature signal with the plurality of temperature thresholds |
申请公布号 |
EP3129851(A1) |
申请公布日期 |
2017.02.15 |
申请号 |
EP20150718049 |
申请日期 |
2015.04.03 |
申请人 |
Qualcomm Incorporated |
发明人 |
NAYAK, Shivank;NAGPAL, Shilpa;KUMAR, Ajeet |
分类号 |
G06F1/20;G06F1/32 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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