发明名称 音響装置の筐体および積層合板
摘要 PROBLEM TO BE SOLVED: To improve the flexibility of the adjustment of acoustic properties of a plate forming a housing of an acoustic device such as a speaker.SOLUTION: A housing of a speaker or the like is formed by a lamination chip board formed by tucking a material, having acoustic properties different from a wooden material, in an intermediate layer made of the wooden material. The intermediate layer tucked in the wooden material is, for example, paper. Tucking paper improves the internal loss of the lamination chip board and adjusts the acoustic properties. The paper is disposed so as to be lopsidedly located close to a front surface or a rear surface of the lamination chip board thereby varying the acoustic properties between the front surface and the rear surface.
申请公布号 JP6078962(B2) 申请公布日期 2017.02.15
申请号 JP20120063265 申请日期 2012.03.21
申请人 ヤマハ株式会社 发明人 岡崎 浩二
分类号 H04R1/02 主分类号 H04R1/02
代理机构 代理人
主权项
地址