发明名称 クーリング機構及び処理システム
摘要 A cooling mechanism includes a plurality of support stands which is provided in a vertical direction over a plurality of stages in an atmospheric transfer chamber where a down-flow is formed, a plurality of support pins which is provided in each of the support stands and supports a target object in contact with the backside of the target object. The cooling mechanism further includes a plurality of air guide plates which is provided in the support stands and cools the target object supported by the support stand located at a lower stage using the down-flow.
申请公布号 JP6079200(B2) 申请公布日期 2017.02.15
申请号 JP20120273363 申请日期 2012.12.14
申请人 東京エレクトロン株式会社 发明人 熊谷 圭太;佐々木 義明;菊嶋 博人;井冨 隼人
分类号 H01L21/02;H01L21/677 主分类号 H01L21/02
代理机构 代理人
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