| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin mold type semiconductor module which inhibits adhesion failure between a heat sink and a metal mold when a resin material is molded to contribute to improvement of the yield while improving heat radiation performance of the heat sink.SOLUTION: A semiconductor module includes: a lead frame 1; a semiconductor element 2 mounted on a surface of the lead frame; a heat sink 3 which has an adhesion part adhered to a rear surface of the lead frame at one surface side and has an irregularity part for heat radiation at the other surface side; and a mold resin 4 which covers the lead frame, the semiconductor element, and the heat sink while exposing at least the irregularity part of the heat sink and integrally molds the lead frame, the semiconductor element, and the heat sink. A first receiving surface 31b which prevents the mold resin from leaking is provided around the irregularity part of the heat sink. A second receiving surface 31c which inhibits the heat sink from being deformed by injection pressure of the mold resin is provided at a part of the irregularity part of the heat sink. The first receiving surface and the second receiving surface are formed as an identical surface of a flat part. |
