| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component that can suppress peeling a resist pattern off from a substrate.SOLUTION: This invention relates to a method for manufacturing an electronic component 1 having a resist pattern. The method for manufacturing the electronic component 1 according to this invention includes the steps of: disposing a first resist material 3 onto a position of a substrate 2 which corresponds to a first region R1 to form a first resist layer 3A; disposing a second resist material 4 onto a position of the substrate 2 which corresponds to a second region R2 to form a second resist layer 4A; and curing the first and second resist layers 3A, 4A to form the resist pattern 5. In the method for manufacturing the electronic component 1 according to this invention, the first region R1 portion of the resist pattern 5 which is formed by the first resist material 3 is continued to the second region portion of the resist pattern 5 which is formed by the second resist material 4. |
