发明名称 切削装置
摘要 The invention provides a cutting device. The cutting device can achieve low cost of the device self and can inhibit large-scale. The cutting device (1) comprises a clamping disc working table (10) attracting and holding an object to be processed (W) through a holding surface (11a), processing members (20a, 20b) for cutting processing of object to be processed (W) by utilization of a cutting knife (21), an X-axis moving member (30) moving the object to be processed (W) between a move-in and move-out region (O) and a processing region (P), and a chip moving member (60) blowing a fluid body to a chip (T) on the clamping disc working table (10) to move the chip (T) into a chip box (100). The chip moving member (60) comprises a chip blowing nozzle (61). The chip blowing nozzle sprays a fluid body (F) towards the chip on the holding surface to blow the chip towards the chip box. The chip box is adjacent to the end part of the X-axis moving member (30) and can be dismounted, and the chip box has an opening in a position lower than the holding surface of the clamping disc working table.
申请公布号 JP6081868(B2) 申请公布日期 2017.02.15
申请号 JP20130127835 申请日期 2013.06.18
申请人 株式会社ディスコ 发明人 福岡 武臣
分类号 H01L21/301;H01L21/677 主分类号 H01L21/301
代理机构 代理人
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