发明名称 ENERGY EFFICIENCY AWARE THERMAL MANAGEMENT IN A MULTI-PROCESSOR SYSTEM ON A CHIP
摘要 Various embodiments of methods and systems for energy efficiency aware thermal management in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, energy efficiency aware thermal management techniques that compare performance data of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by adjusting the power supplies to, reallocating workloads away from, or transitioning the power mode of, the least energy efficient processing components. In these ways, embodiments of the solution optimize the average amount of power consumed across the SoC to process a MIPS of workload.
申请公布号 EP3129854(A1) 申请公布日期 2017.02.15
申请号 EP20150719925 申请日期 2015.04.08
申请人 Qualcomm Incorporated 发明人 PARK, Hee Jun;KANG, Young Hoon;ALTON, Ronald Frank;MEDRANO, Christopher Lee;ANDERSON, Jon James
分类号 G06F1/20;G06F1/26 主分类号 G06F1/20
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