Semiconductor package and manufacturing method thereof

摘要

A semiconductor package includes a substrate, at least one support, a cover, and a plate. The substrate has at least one light sensor or thermal sensor, a first surface, and a second surface opposite to the first surface. The light sensor or the thermal sensor is disposed on the first surface. The second surface has an opening to expose the light sensor (or the thermal sensor). The support is disposed on the first surface. The cover is disposed on the support, such that the cover is above the light sensor (or the thermal sensor) to form a first space between the cover and the light sensor (or the thermal sensor). The plate is placed on the second surface to cover the opening, such that a second space is formed between the plate and the light sensor (or the thermal sensor).

主权项

1. A semiconductor package, comprising:
a substrate having at least one light sensor or at least one thermal sensor, a first surface, a second surface opposite to the first surface, and a sidewall that is adjacent to the first and second surfaces, wherein the at least one light sensor or the at least one thermal sensor is disposed on the first surface, wherein the first surface of the substrate has at least one electrical connecting pad that protrudes from the sidewall, wherein the second surface of the substrate has an opening to expose the at least one light sensor or the at least one thermal sensor, and wherein the sidewall faces away from the opening; at least one support disposed on the first surface of the substrate; a cover disposed on the at least one support, such that the cover is above the at least one light sensor or the at least one thermal sensor to form a first space between the cover and the at least one light sensor or between the cover and the at least one thermal sensor; a plate placed on the second surface of the substrate to cover the opening, such that a second space is formed between the plate and the at least one light sensor or between the plate and the at least one thermal sensor; and an isolation layer between the second surface of the substrate and the plate, and covering the sidewall of the substrate and the at least one electrical connecting pad that protrudes from the sidewall, wherein the isolation layer does not extend beyond a top most surface of the plate adjacent the second surface of the substrate.