Electronic device

摘要

An electronic apparatus and a heat dissipation plate are provided. The electronic device includes a frame or a housing, at least one heat generating unit and a heat pipe, wherein the heat dissipation plate includes the frame and the heat pipe. The heat pipe is disposed on the frame or the housing. An orthogonal projection of the heat pipe on the frame or on the housing is partially overlapped with an orthogonal projection of the heat generating device on the frame or on the housing.

主权项

1. An electronic device mobile handheld device, comprising:
a housing, comprising a front cover and a rear cover; a frame located between the front cover and the rear cover; a display module, disposed between the frame and the front cover; a touch module, disposed on the display module, a circuit board, attached to the frame; at least one heat generating unit disposed on the circuit board; and a heat pipe, disposed on the rear cover of the housing and located between the circuit board and the rear cover of the housing, wherein an orthogonal projection view of the heat pipe projected on the rear cover of the housing is at least partially overlapped with an orthogonal projection view of the at least one heat generating unit projected on the rear cover of the housing, and a thickness of the heat pipe is 0.25 mm to 1.00 mm, wherein an area of the frame is larger than an area of the circuit board, and wherein the at least one heat generating unit is a central processing unit, a charging chip, a power management chip, or a radio frequency chip.