Piezoelectric device and method for manufacturing piezoelectric device

摘要

In a method for manufacturing a piezoelectric device while stably achieving strong bonding, a moisture-absorbing layer is formed on a bonding surface side of a piezoelectric single-crystal substrate. The moisture-absorbing layer is allowed to absorb moisture. A binder layer is formed on a bonding surface side of a supporting substrate. The moisture-absorbing layer is placed on the binder layer. A silica precursor in the binder layer is converted into silica through a hydrolysis reaction with moisture in the moisture-absorbing layer.

主权项

1. A piezoelectric device, comprising:
a supporting substrate; a moisture-absorbing layer disposed on the supporting substrate; a piezoelectric thin film disposed on the moisture-absorbing layer; and a silicon oxide layer disposed between the piezoelectric thin film and the moisture-absorbing layer; wherein the moisture-absorbing layer is more hygroscopic than the piezoelectric thin film and the supporting substrate, and is in contact with the silicon oxide layer.