| 发明名称 | Method of encapsulating an optoelectronic device and light-emitting diode chip | ||
| 摘要 | A method of encapsulating an optoelectronic device includes providing a surface intended to be encapsulated, the surface containing platinum, generating reactive oxygen groups and/or reactive hydroxyl groups on the surface, and depositing a passivation layer by atomic layer deposition on the surface. | ||
| 申请公布号 | US9570662(B2) | 申请公布日期 | 2017.02.14 |
| 申请号 | US201214413029 | 申请日期 | 2012.07.10 |
| 申请人 | OSRAM Opto Semiconductors GmbH | 发明人 | Taeger Sebastian;Huber Michael;Welzel Martin;Engl Karl |
| 分类号 | H01L21/00;H01L33/54;H01L33/44;H01L33/56 | 主分类号 | H01L21/00 |
| 代理机构 | DLA Piper LLP (US) | 代理人 | DLA Piper LLP (US) |
| 主权项 | 1. A method of encapsulating an optoelectronic device comprising: providing a surface intended to be encapsulated, said surface containing platinum; generating reactive oxygen groups and/or reactive hydroxyl groups on said surface containing platinum, wherein the reactive oxygen groups and/or the reactive hydroxyl groups on said surface containing platinum are generated by one of treatment with oxygen containing plasma or treatment with ozone; depositing a passivation layer by atomic layer deposition on said surface containing platinum; and depositing a further dielectric layer on the passivation layer. | ||
| 地址 | DE | ||