发明名称 Methods of doping substrates with ALD
摘要 Provided are methods of doping substrates and making doped semiconductor features. An exemplary method includes providing a substrate having at least one feature having an aspect ratio; depositing a layer of dopants onto the substrate, the layer of dopants having a shape conforming to the at least one feature. A dielectric layer is deposited onto the layer of dopants, the dielectric layer having a shape conforming to the layer of dopants. The dielectric layer is annealed to diffuse the dopants into the substrate.
申请公布号 US9570307(B2) 申请公布日期 2017.02.14
申请号 US201514939403 申请日期 2015.11.12
申请人 APPLIED MATERIALS, INC. 发明人 Nainani Aneesh;Abraham Mathew;Ping Er-Xuan
分类号 H01L21/22;H01L21/225;H01L29/66;H01L21/02 主分类号 H01L21/22
代理机构 Servilla Whitney LLC 代理人 Servilla Whitney LLC
主权项 1. A method of doping a FinFET transistor, the method comprising: depositing a layer of dopants onto a substrate; depositing a dielectric layer onto the layer of dopants; implanting silicon or argon into the dielectric layer prior to annealing the dielectric layer; and annealing the dielectric to diffuse the dopants into the substrate.
地址 Santa Clara CA US