发明名称 |
Methods of doping substrates with ALD |
摘要 |
Provided are methods of doping substrates and making doped semiconductor features. An exemplary method includes providing a substrate having at least one feature having an aspect ratio; depositing a layer of dopants onto the substrate, the layer of dopants having a shape conforming to the at least one feature. A dielectric layer is deposited onto the layer of dopants, the dielectric layer having a shape conforming to the layer of dopants. The dielectric layer is annealed to diffuse the dopants into the substrate. |
申请公布号 |
US9570307(B2) |
申请公布日期 |
2017.02.14 |
申请号 |
US201514939403 |
申请日期 |
2015.11.12 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
Nainani Aneesh;Abraham Mathew;Ping Er-Xuan |
分类号 |
H01L21/22;H01L21/225;H01L29/66;H01L21/02 |
主分类号 |
H01L21/22 |
代理机构 |
Servilla Whitney LLC |
代理人 |
Servilla Whitney LLC |
主权项 |
1. A method of doping a FinFET transistor, the method comprising:
depositing a layer of dopants onto a substrate; depositing a dielectric layer onto the layer of dopants; implanting silicon or argon into the dielectric layer prior to annealing the dielectric layer; and annealing the dielectric to diffuse the dopants into the substrate. |
地址 |
Santa Clara CA US |