Testing of semiconductor packages with integrated antennas

摘要

A semiconductor package includes a semiconductor die, an antenna embedded in insulating material contacting a first main side of the semiconductor die and electrically connected to a first pad of the semiconductor die and a coupling structure embedded in the insulating material, electrically connected to a second pad of the semiconductor die and spaced from the antenna. The coupling structure is configured to sense energy radiated from the antenna or a feedline connected to the antenna. The semiconductor die includes a transmitter circuit operable to drive a signal onto the antenna through the feedline. The semiconductor die also includes a transmit path verification circuit operable to indicate if the antenna is electrically connected to the first pad of the semiconductor die based on a signal from the coupling structure that corresponds to the energy sensed by the coupling structure.

主权项

1. A semiconductor package, comprising:
a semiconductor die; an antenna embedded in insulating material contacting a first main side of the semiconductor die and electrically connected to a first pad of the semiconductor die; and a coupling structure embedded in the insulating material, electrically connected to a second pad of the semiconductor die and spaced from the antenna, wherein the coupling structure is configured to sense energy radiated from the antenna or a feedline connected to the antenna, wherein the semiconductor die includes a transmitter circuit operable to drive a signal onto the antenna through the feedline, wherein the semiconductor die includes a transmit path verification circuit operable to indicate if the antenna is electrically connected to the first pad of the semiconductor die based on a signal from the coupling structure that corresponds to the energy sensed by the coupling structure.