发明名称 Electronic circuit device and method for manufacturing electronic circuit device
摘要 In an electronic circuit device, a circuit board (40) is disposed in an inner case (10), a light emitting element (50) is mounted on a surface on the reverse side of the surface having the circuit board (40) mounted thereon, and a light emitting element (50) is sealed by injecting a translucent resin (60) into the inner case (10). The inner case (10) is provided with a cylindrical section (12) that surrounds the light emitting element (50), and it is configured such that the height of the translucent resin (60) injected into the cylindrical section (12) is more than the height of the translucent resin (60) injected to the outside of the cylindrical section (12).
申请公布号 US9568169(B2) 申请公布日期 2017.02.14
申请号 US201314759334 申请日期 2013.12.13
申请人 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. 发明人 Sasaki Koichi
分类号 F21V15/01;F21V19/00;F21V33/00;H05K3/28;H04B1/034;H01L33/54 主分类号 F21V15/01
代理机构 Pearne & Gordon LLP 代理人 Pearne & Gordon LLP
主权项 1. An electronic circuit apparatus comprising: an upper case and a lower case that form a case; a circuit board mounted on the lower case; an inner case including a hollow frame body that surrounds the circuit board, the inner case being configured to hermitically seal an inside of the inner case by bonding a top surface and an undersurface of the frame body to the upper case and the lower case, respectively; an electronic part including a light-emitting element that is provided on a surface of the circuit board opposite to a mounting surface of the circuit board and that emits light at least to outside; and a light-transmissive resin that is injected into the frame body of the inner case to seal the electronic part and that allows irradiating light of the light-emitting element to pass through the light-transmissive resin to outside, wherein the inner case includes a cylindrical part that surrounds the light-emitting element in the frame body and a height of the light-transmissive resin injected into the cylindrical part is greater than a height of the light-transmissive resin injected into a region outside the cylindrical part.
地址 Osaka JP