Circuit device and method for manufacturing same

摘要

Provided are: a circuit device which has improved connection reliability in a solder joint portion by suppressing the occurrence of sink of solder; and a method for manufacturing the circuit device. In a method for manufacturing a circuit device of the present invention, a plurality of solders (19), which are apart from each other, are firstly formed on the upper surface of a pad (18A), and a chip component (14B) and a transistor (14C) are affixed at the same time. After that, a solder paste (31) is supplied to the upper surface of the pad (18A) using a syringe (30), a heatsink (14D) is mounted on top of the solder paste (31), and melting is caused by a reflow process. There is little risk of sinking of the solders (19) in the present invention since the solders (19) are discretely arranged on the upper surface of the pad (18A).

主权项

1. A method of manufacturing a circuit device, comprising the steps of:
providing a substrate having a pad formed thereon, the pad having an upper surface; forming a plurality of portions of a first solder on the upper surface of the pad, the portions of the plurality of portions of the first solder being spaced away from each other so that they can maintain a discretized state even after they are melted, and wherein the portions of first solder are arranged as an array of elements laterally positioned in rows and columns on the upper surface of the pad; and heating the plurality of portions of the first solder to melt the portions of the plurality of portions of the first solder, wherein each portion of the plurality of portions of the first solder maintains a discretized state after melting, and wherein each portion of the plurality of portions of the first solder comprises an alloy portion having a first thickness formed vertically between a corresponding portion of the pad and a solder portion; applying a second solder to the upper surface of the pad and the plurality of solder portions; mounting a component to the second solder; and heating the second solder and the discretized portions of the plurality of portions of the first solder to form an alloy layer, wherein heating the second solder increases the thickness of the alloy portions between the corresponding portions of the pad and the solder portions to a second thickness and creates another alloy portion laterally between the plurality of solder portions, the another alloy portion having a third thickness, the third thickness less than the second thickness.